Assembly Division Capabilities

• Design, Engineering, and E.C.O Support
• SMT,  4 lines (see details in equipment section)
• Wave Soldering  (see details in equipment section)
• Press fit connectors insertion machine
• BGA, Ceramic BGA and Micro BGA capability
• BGA rework and Inspection capability
• Re-Balling of BGA components
• ROHS compliance
• Mechanical assembly
  (including boxes, harnesses, cables)
• ICT, J-Tag, Functional testing
  and testability design support
• 3D X-Ray for BGA quality
• ICT Fixture development and programming
• ESS and Burn-in