Our PWB division specializes in the manufacture of a wide range of board types. The emphasis on R&D has helped us become a market leader in the development and manufacturing of advanced PWBs.

Our capabilities enable us to offer:

• Rigid boards up to 42 layers
• Flex and Rigid-Flex boards up to 40 layers
• Hybrid solutions for Microwave/RF applications
• Thermal and signal integrity management solutions, employing coins and cavities
• 2D or 3D heat-sinks: Copper and Aluminum
• Carbon printing
• HDI – blind, buried, staggered & stacked vias
• Buried passive components: capacitors and resistors
• In-house HATS lab