Our PWB division specializes in the manufacture of a wide range of board types. The emphasis on R&D has helped us become a market leader in the development and manufacturing of advanced PWBs.
Our capabilities enable us to offer:
- Rigid boards up to 42 layers
- Flex and Rigid-Flex boards up to 40 layers
- Hybrid solutions for Microwave/RF applications
- Thermal and signal integrity management solutions, employing coins and cavities
- 2D or 3D heat-sinks: Copper and Aluminum
- Carbon printing
- HDI – blind, buried, staggered & stacked vias
- Buried passive components: capacitors and resistors
- In-house HATS lab