PCB Capabilities
( View Table Of Capabilities)

Special Capabilities

• buried capacitors - In R&D .
• buried resistors.
• Via filling capabilities with functional materials: 
• Dilectric: PETERS plugging paste, ceramic-epoxy based
  (PP 2765-SD for example) – In mass production (OPTION OF SELECTIVE VIA FILLING).
  
• Conductive:
  
  • Electro-plating Copper – In mass production
    
  • Plugging with conductive fill, such as Silver paste etc. – In R&D.
    
• Micro-via & blind via plug.
• Carbon paste: for touch pads.
• STACKED VIA.

Comment: PCB Technologies and our staff of specialists aspire to promote and endorse
novel ideas and technological developments geared towards the adaptation of different plugging materials, in order to meet individual
customer requirements.

• Combined / Hybrid boards: combinations of different types of laminates.
• Specialists in RF circuits:
  
  • RF (ANTENNA) double sided circuits with dimensions of 0.5X2.5 m.
    
  • Laser ablation of cavities on RF circuits.
  • Extreme accuracy in line etching.
• Back-panels: with thickness < 8.5 mm (in mass production).
• Back drilling:
• Silver paste for EMI  [electro magnetic interference] Shielding.
• SELECTIVE FINISHING
• METAL CORES (AL/CU/CIC) WITH ROSIN FILLING.

Materials
PCB Technologies works and partners with world-class qualified suppliers that use the best materials available for printed circuit board (PCB) manufacturing. The company's detailed and comprehensive material inspection process ensures that suppliers comply with all requirements for satisfying customer needs.
Materials used by the company include:

• Glass epoxy (GF) laminate, Tg - 180ºc Epoxy
• Polyamide (GI) laminate
• BT/Epoxy (GMN)
• Teflon base  (differing dielectric constant from various manufacturers)
  with Aluminum or brass backing.
• Thermount (BI, aramid) epoxy and polyamide base
• Kapton (adhesive and adhesiveless)
• No flow prepregs (GF, GI, acrylic)
• Materials for high-speed applications (NELCO 4000-13 SI).
• GETEK
• RO 6000, RO 4000, RO 3000
• ARLON'S 99ML THERMALLY CONDUCTIVE MULTIFUNCTIONAL EPOXY
• NELCO9220
• PP SPEED BOARD

Finishing Technologies
PCB Technologies understands the importance of board finishing in high-level assembly and testing. Based on customer, product and application requirements, the company has developed various finishing technologies facilitating the production of high-performance printed circuit boards (PCBs) that are durable, reliable and stable.
PCB Technologies offers a high-quality, process-controlled orientation that provides customers with the most appropriate solution for any finishing technology required.
The types of finishing available include:

• Hot air solder leveling (HASL) Tin-lead.
• Organic Solderable Preservative (OSP)
• Electro less Nickel and Immersion Gold   
• Immersion Silver
• Immersion Tin
• Electrolytic Nickel/Gold, hard and soft (wire bondable)
• Electrolytic Mat Tin
• Selective Nickel/Gold
• Via holes plugging (Copper, Silver solder mask, epoxy)
• Carbon paste: used for touch pads.
• Selective finishing:
• Immersion & Electroplating Gold.
• Combination of Electro-plating & Immersion finishing.
• ENIG with Electrolytic mat tin.
• Electrolytic mat tin with electrolytic Ni-Au.
• Heat sink finishing:
• Electrolytic Nickel.
• Electrolytic soft Gold

Rigid & Rigid-Flex PCB
CATEGORY		STANDARD	SPECIAL
Board Thickness
Minimum		0.008"	0.004"
Maximum		0.200"	0.340"
Panel/Board Dimensions
Minimum Panel Dimensions		9"X12"	9"X12"
Maximum Panel Dimensions		18"X24"	26"X60"
Minimum Lines &Spaces
Lines-Internal (0.5oz based copper thick.)		0.0030"	0.0025"
Lines-External (0.5oz based copper thick.)		0.0040"	0.0030"
Spaces-Internal (0.5oz based copper thick.)		<0.0030"	0.0025"
Spaces-External (0.5oz based copper thick.)		0.0040"	0.0030"
Layer Count
Maximum Layer Count - rigid		32	40
Maximum Layer Count - multi-flex		10	12
Maximum Layer Count - rigid/flex>		26*	30*
* Structure related
Based Copper Thickness Capability
5 µ		Yes	Yes
0.25 oz =~ 9 µ		Yes	Yes
0.5 oz		Yes	Yes
1.0 oz		Yes	Yes
2.0 oz		Yes	Yes
3.0 oz		N/A	Yes
4.0 oz		N/A	Yes
6.0 oz		N/A	Yes
Annular Ring (pad to drill difference)
Internal Layers		0.010"	0.008" Tear-drops preferred
External Layers		0.010"	0.008"
Minimum Hole to Line		0.008"	0.006"
Drilling Capability
Minimum Drilled Hole		0.008"	0.004"
Hole Location Accurac		0.0015"	0.0012"
Image to Hole Location Accuracy		0.002"	0.0005"
Aspect Ratio		1:8	1:13
Micro-via Drilling Aspect Ratio		1:0.8	1:1
Micro-via Drilling Diameter		0.004"	0.003"
Micro-via Stop Pad Diameter		0.010"	0.008"
CATEGORY		STANDARD	SPECIAL
Solder Mask
Minimum Solder Mask Clearance SMD Pads		0.0015"	0.0010"
Minimum Solder Mask Dam Between SMD Pads		0.005"	0.004"
Minimum Solder Mask Thickness		12µ - 18µ	12µ - 18µ
Plating Capability
Average Copper Plating		25µ	25µ
Minimum Copper Plating		20µ	20µ
Minimum Tin/Lead as Plated (if applicable)		7µ	7µ
Nickel Thickness		2.5µ - 12µ	2.5µ - 12µ
Gold Edge Connector Thickness		0.8µ - 1.2µ	0.8µ - 1.2µ
Soft Gold 24kt Thickness		0.8µ - 2.5µ	Up to 4µ
Selective Electrolytic Gold plating		0.8µ - 2.0µ	Up to 4µ
OSP Thickness		0.2µ - 0.35µ	0.2 - 0.35µ
HAL Thickness		1µ - 15µ	1µ - 15µ
Immersion Gold Thickness		0.05µ - 0.15µ	0.05µ - 0.15µ
Immersion Tin Thickness		Up to 1.2µ	Up to 1.2µ
Immersion Silver Thickness		Up to 0.2µ	Up to 0.2µ
Machining
Routing Tolerance		±0.004"	±0.002"
Hole to Edge Location		±0.004"	±0.002" laser machine
V-Groove Angles Capability		20°, 30°, 45°	20°, 30°, 45°
Electrical Test
Single Ended Impedance		Yes	Yes
Differential Impedance		Yes	Yes
Test Voltage		0.5-500 volts
Max Isolation Resistance		500 M ohm
Min Continuity Resistance		1 ohm
Supplying Term
Rigid	8-10		2-5
Rigid-Flex	14-21		7-10

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