PCB Equipment

PWB Manufacturing:

• Over 14 CAM work stations
• Multiple laser plotters
• AOI systems for artwork inspection

Inner Layer Processes

• Chemical preparation line
• Multiple exposures with auto alignment
• Multiple Develop Etch (acid) Strip lines
• Copper anti-tarnish
• Post Etch Punch
• 6 AOI systems for inner layers in-process inspection
• Automatic oxidation line
• Automatic layer preparation to lamination
• Full automatic vacuum system lamination press with 4 press units
• 7 vacuum assisted lamination presses
• 2 vacuum chambers for prepreg preparation

Drilling & Machining Processes

• 66 drilling spindles
• 16 drill & rout spindles
• Laser drilling machines for micro via technology
• X-ray machine for in-process alignment control
• Automatic V-Cut with depth control
• X-Y measuring table for in-process inspection

Outer Layer Processes

• Hole preparation - Scrubing with high pressure assistant
• Automatic controlled smear removal and glass etch
• Plasma unit
• Automatic plating line for high & low electro-less Copper deposit
• Panel preparation for external imaging
• Multiple automatic cut laminators
• Multiple exposures
• Developers
• 2 automatic Copper and Tin-lead plating
  lines with auto controls and replenishments
• Automatic line for Gold edge plating
• Automatic line for electro-less Nickel and immersion Gold
• 2 Manual lines for Nickel and immersion Gold - Engineering products
• Manual line for immersion Tin plating
• Multiple Strip-Etch-Strip lines
• IR and Oil reflow
• Horizontal Hot Air Solder Leveling
• Organic Coating
• Immersion Silver Coating
• Full Automatic PAL Electrolytic Soft Gold Plating Line
• Soldermask Spray Coating
• Direct Ink Jet Machine For Legend Implementation

Via plugging semi-automation tool:

• In mass production: plug buried / blind via & PTH holes with PETERS dielectrics, to avoid air inclusions & different coefficients of thermal expansion (CTE) (which can result in
  elaminating & cracking)
• In R&D: plug via with conductive materials, such as Silver paste, etc.

Bare Board Electrical Testing:

• Single sided and double sided testers
• Flying probes testers
• TDR measurement

Laboratory:

• Solderability tester
• Measurement of OSP and oxide thickness
• Ionograph for surface contamination
• Elongation & Peel Strength testing
• Micro-Section preparation and inspection
• Fully equipped lab for in-process analysis
• XRF measurement machine
• Computerized micro-section archive system
• Sonoscan Ultrasonic Inspection System