We understand the importance of board finishing in high-level assembly and testing.

Based on customer, product and application requirements, the company has developed various finishing technologies facilitating the production of high-performance PCBs that are durable, reliable and stable. 

We offer a high-quality, process-controlled orientation that provides customers with the most appropriate solution for any finishing technology required.

The types of finishing available include: 

• Hot air solder leveling (HASL) Tin-lead.
• Organic Solderable Preservative (OSP) 
• Electro less Nickel and Immersion Gold   
• Immersion Silver 
• Immersion Tin 
• Electrolytic Nickel/Gold, hard and soft (wire bondable) 
• Electrolytic Mat Tin 
• Selective Nickel/Gold
• Via holes plugging (Copper, Silver solder mask, epoxy)
• Carbon paste: used for touch pads.
• Selective finishing: 
  • Immersion & Electroplating Gold.
  • Combination of Electro-plating & Immersion finishing. 
  • ENIG with Electrolytic mat tin.
  • Electrolytic mat tin with electrolytic Ni-Au.
• Heat sink finishing:
  • Electrolytic Nickel.
  • Electrolytic soft Gold